IEEE Transactions on Components, Packaging and Manufacturing Technology, Part B: Advanced Packaging
Availability: | Im Campus-Netz sowie für Angehörige der Universität auch extern zugänglich |
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Licensed Period: | IEEE Electronic Library (IEL) Universitätskonsortium: Jg. 17 (1994) - Jg. 21 (1998) ReadMe |
Fulltext: | http://emedien3.sub.uni-hamburg.de/ezb/start?ezbid=1405&title=IEEE+Tra… |
Homepage(s): | |
Fulltext available since: | Volume 17 (1994) |
Fulltext available until: | Volume 21 (1998) |
Publisher: |
Institute of Electrical and Electronics Engineers (IEEE) ; IEEE Components, Packaging and Manufacturing Technology Society Search publishers open access policy in SHERPA/RoMEO |
ZDB-ID: | 2027506-7 |
Subject(s): | Elektrotechnik, Elektronik, Nachrichtentechnik, Maschinenbau |
Tag(s): | Elektronik,Fertigungstechnik |
E-ISSN(s): | 1070-9894, 1558-3686 |
Appearance: | Volltext, Online und Druckausgabe |
Costs: | kostenpflichtig |
Comment: | Erscheinungsverlauf: 1.1965,1 - 7.1971,1 u.d.T.: IEEE Transactions on Parts, Materials and Packaging (0018-9502) 7.1971,2 - 13.1977 u.d.T.: IEEE Transactions on Parts, Hybrids, and Packaging (0361-1000) 1.1978 - 16.1993 u.d.T.: IEEE Transactions on Components, Hybrids, and Manufacturing Technology (0148-6411) 17.1994 - 21.1998 u.d.T.: IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging (1070-9894) Ab 22.1999 u.d.T.: IEEE Transactions on Advanced Packaging (1521-3323) |
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